Semiconductor full chain aggregation, IICIE International Integrated Circuit Innovation Expo to be held in Shenzhen in September

The IICIE International Integrated Circuit Innovation Expo (IC Innovation Expo) will be held from September 9-11 at the Shenzhen International Convention and Exhibition Center. This year's exhibition presentsChip and chip design, power semiconductor, wafer manufacturing and packaging testing services, semiconductor equipment, semiconductor materials, semiconductor core componentsWaiting for the entire industry chain link. and withCIOE China Light Expo, Elexcon Shenzhen International Electronics ShowJointly held, with a total exhibition area of 320000 square meters, over 5000 exhibiting companies, and an estimated 240000 professional visitors, covering the three key fields of semiconductors, optoelectronics, and electronic embedded systems. Visitors can visit the three exhibitions with one pass, efficiently achieving resource docking.

　　penetrateSemiconductor ManufacturingThe entire industry chain covers the entire process from wafer manufacturing to core components

As a professional display platform for the entire semiconductor chain, this year's IICIE exhibition fully coversWafer Manufacturing - Packaging Testing - Semiconductor Equipment - Semiconductor Materials - Core ComponentsThe entire industry chain focuses on underlying process support and advanced technology iteration, showcasing cutting-edge technologies and products such as 2.5D/3D advanced packaging, hybrid bonding heterogeneous integration, silicon optics, CPO, HBM storage, etc., providing core support for industrial scale commercialization.

In the field of wafer manufacturing and packaging testing, leading enterprises such as Jita Semiconductor, Huahong Group, Jinghe Integration, Wuhan Xinxin, Tongfu Microelectronics, and Huatian Technology will bring wafer manufacturing and advanced packaging technologies such as 12 inch wafers (28 nanometer high-efficiency streamlined process), silicon optical wafers, 3D integrated wafers, advanced logic processes, and mixed signal processes.

　　This exhibition gathers high-quality enterprises from the entire industry chain, and the core exhibiting lineup in each segmented field is as follows:

　　▶Wafer manufacturing and packaging testing technology and services:Huahong Group, Jita Semiconductor, Jinghe Integration, Wuhan Xinxin, Zengxin Technology, Tongfu Microelectronics, Huatian Technology, Xinzhi Microelectronics, Baiwei Storage, Times Minxin, Ruili Pingxin, Xinxin Advinno、 Anji Haiwanxin

　　▶Semiconductor equipment:Shengmei Shanghai, Tuojing Technology, Huahai Qingke, Weichong Semiconductor, Huayu Semiconductor, Jingce Electronics, Beijing Zhongdian Science and Technology, Zhongke Feice, Longyoude, Huazhuo Jingke, Maiwei Technology, Dongfang Jingyuan, Weijia Technology, Sanfeng Precision, Rongdao Society, Guanli Technology, Optical Particle Semiconductors

　　▶Semiconductor materials:Shanghai Silicon Industry, Tianke Heda, Anji Technology, CSSC Special Gas, Shanghai Xinyang, Qingyiwei, Xilong Science, Fangda Charcoal, Mulinsheng, Benlang New Materials, Yisheng Technology, Zhongbao New Materials

　　▶Semiconductor core components:Zhongke Instrument, Xinsong Semiconductor, Wanrui Cold Electric, Shangyin Technology, Xinlai Group, Canrui Technology, Sibeike, Keyence, Guanye Transmission, Oulai New Materials, Sida Quan, Xingqi Semiconductor, Zhongke 4.0

　　IWAPS Lithography Display AreaBringing together enterprises in the fields of photolithography measurement and testing, precision optics, process thermal management, photoresist raw materials, and equipment cleaning and maintenance, covering full support for exposure, pattern detection, material supply, and equipment assurance, showcasing integrated solutions that support stable mass production of advanced photolithography processes, and assisting in the improvement of photolithography process yield and technological iteration. Participating companies: Thermo Fisher, Adwan Testing, Jiere Technology, Drip Micro Light, Juming Chemical, Ruiyue Trading, Changsha Aisen, etc.

More wafer manufacturing and packaging testing services and equipment manufacturers can be seen at the Three Exhibition linkage site, including GlobalFoundries, Tower Semiconductor, Chiplink Integrated, and United Microelectronics PIC、ASTRO PLASMA、ASMPT、JEOL、Raith、E-Globaledge、Samco、 NanoTech Yi, Runhua Quanxin Micro, Schmiek, Silikang, Huachuang Intelligent Finetech、MRSI(Mycronic Group)、MKS、OXFORD INSTRUMENTS、 Smart Cube, Shenzhen Kerui, MingsairobotKaige Precision, Kuaike Core Equipment, Qingting, Sibo Micro, Chengfeng Electronics, Zhongke Guangzhi MPI、 Lin Weina, Senmei Xier PI、 Dongfang Motor, ACS Motion Control (China), etc.

　　Focus on popular tracks,Domestic chip innovationProduct intensivemake an appearance

Relying on the core hinterland advantage of Shenzhen's South China electronic information industry, this exhibition focuses on three popular tracks: high-performance computing power, automotive electronics, and consumer electronics, showcasing innovative products and solutions for chips and core components. The exhibition has successfully attractedZTE Microelectronics, China Resources Microelectronics, BYD Semiconductor, iTech Microelectronics, Beijing Junzheng, Zhaoxin Integrated, Lanqi Technology, Ziguang Guowei, Guangli Microelectronics, Fudan MicroelectronicsWaiting for enterprises.

In terms of high-performance computing power, companies such as Lanqi Technology, Damo Institute Xuantie, Fudan Microelectronics, Yunlian Semiconductor, and Huaqiang Semiconductor will bring ultra-high performance cloud security chips, memory expansion controllers, and more RISC-V CPU、 Cutting edge products such as programmable system on chip chips and Ascend edge AI intelligent computing systems comprehensively demonstrate the hard core strength of domestic computing power.

In the automotive field, companies such as ZTE Microelectronics, BYD Semiconductor, AXD Anxinda, etc. showcased their core products at the automotive standard level, covering automotive grade 5G+V2X chips, 4nm intelligent driving chips, embedded storage chips, automotive electronics AI MCU chips, etc., to assist in the localization and high-end upgrading of automotive chips.

In the consumer electronics field, companies such as Zhixinke, Taixin Semiconductor, and Weijie Semiconductor bring innovative products such as ultra-low power end side multimodal inference chips, high-precision accelerometer sensors, audio and video Wi Fi SOC chips, which are suitable for diverse application scenarios such as smart wearables and terminal consumption.

The exhibition revolves aroundChip design, open source ecosystem, computing power applicationCreate multiple characteristic themed exhibition areas in the core direction, and work together with the vertical media "Chip Master" to createAI Application Feature Display AreaInviting companies such as Jingwei Qili, Jihai Semiconductor, Liuyue Microelectronics, and Canxin Semiconductor to focus on popular topics such as automotive electronics, high-performance computing power, and smart wearables;

At the same time, we will collaborate with Comic Talk IC and Chip Talk IC TIME to createRISC-V Ecological Application Exhibition AreaGathering high-quality domestic RISC-V enterprises such as Damo Academy Xuantie, Sino German Industry, Computing Technology, Guoxin Technology, and Jindian Space, we will showcase processor IP, high-performance computing chips, software and hardware platforms, and full scenario implementation solutions, fully demonstrating the full chain ecological capabilities of domestic RISC-V from underlying architecture research and development to real-world applications.

exclusiveChip and Design Display AreaFully covering multiple core tracks such as computing power GPU, robot control, optoelectronic interconnection, in memory computing AI, IoT wireless SoC, industrial embedded storage, etc., gathering enterprises such as Zhixian Future, Xiangdixian, Zhuhai Yiwei, Anxinda, etc., showcasing diversified domestic chip innovation achievements and integrated industry solutions.

The one-stop visit through the linkage of three exhibitions will also seeOptical communication chips, sensor chips, storage chips and modules, power semiconductors and power suppliesMore companies and product displays, including some exhibiting companies such as COHERENT MITSUBISHI ELECTRIC、SICOYA、SIFOTONICS、WD PHOTONICS、 Xinsijie, Qixin, Niobiao Optoelectronics, Changguang Huaxin, Saile, Xihe, Guoke Guangxin, Shijia, Dingxin, Cambridge, Yunling, Xizhi Technology, Shanghai Beiling, Aipu, Rongmei, Xinlong, Taimao, Xin'an Semiconductor, Jiangzhi Technology, Yuanbo Technology, etc.

　　Gathering the scientific research forces of universities to directly target the forefront of semiconductor technology

To promote the transformation of semiconductor technology achievements and assist in industrial innovation and upgrading, this exhibition has set up a special eventUniversity Research Achievement Exhibition Area (Hall 16)Gather top domestic universities and research institutes to build a precise platform for industry university research integration. The participating institutions cover more than ten universities and research institutes, including Guangdong Zhongke Semiconductor Micro Nano Manufacturing Technology Research Institute, Guangzhou Hong Kong University of Science and Technology Huo Yingdong Research Institute, Sun Yat sen University School of Integrated Circuits, Tsinghua University School of Integrated Circuits, Shenzhen University of Technology, and Shenzhen University of Technology School of Integrated Circuits.

On site, cutting-edge scientific research achievements such as wafer level thin film lithium niobate photonic chips, large-scale hybrid integrated optical quantum computers, advanced packaging interface failure reliability solutions, glass substrates and TGV processes, photosensitive polyimide packaging materials, etc. will be showcased, accurately matching enterprise technology needs and investment and financing resources, and accelerating the industrialization of high-end technology from the laboratory.

　　Over 20 professional forums will be held simultaneously to explore the new future of the industry

More than 20 high-quality professional conferences will be launched simultaneously with the exhibition, coveringchipandApplications, semiconductor manufacturing, advanced packaging testingWide bandgapSemiconductors, intelligent manufacturing, green factory servicesGathering hundreds of global industry leaders, authoritative experts, and senior analysts in core areas, focusing on industry pain points, dismantling technology trends, sharing practical experience, and providing forward-looking guidance for industry development.

among which,The 10th International Symposium on Advanced Photolithography Technology (IWAPS)As an annual academic and industry benchmark event, it will focus on cutting-edge technologies in the field of lithography and promote innovative breakthroughs in advanced lithography processes;Global Semiconductor Analyst ConferenceWith the theme of "Navigating the Semiconductor New Era from 2026 to 2030- Reshaping Industry Driving Forces, Moving from Zero Sum Game to Collaborative Innovation", we gather global industry wisdom, predict the transformation path and new growth drivers of the semiconductor industry in the next five years, and empower the industry to achieve high-quality collaborative development.

Viewers can register with just one click,One certificate overview, three exhibitions at the same time, and various forum activitiesFrom September 9th to 11th, at the Shenzhen International Convention and Exhibition Center, the IICIE International Integrated Circuit Innovation Expo cordially invites industry colleagues from around the world to gather and jointly build a new ecosystem for the semiconductor industry!