The entire chain is ready! IICIE International Integrated Circuit Innovation Expo opens in Shenzhen on September 9th

The 2026 IICIE International Integrated Circuit Innovation Expo (IC Innovation Expo) will be grandly held from September 9-11 at the Shenzhen International Convention and Exhibition Center (Bao'an). This exhibition aims toCross borderfusion·Collaborative across the entire chain, jointly building a distinctive core ecosystemAs the theme, it will be displayed in halls 14-16 of Shenzhen International Convention and Exhibition Center. Exhibition andCIOE China Light Expo, Elexcon Shenzhen International Electronics ShowHeld simultaneously and in the same location. The total exhibition area is 320000 square meters, with over 5000 exhibiting companies and an expected attendance of over 240000 professional visitors, covering the three key fields of semiconductors, optoelectronics, and electronic embedded systems. Visitors can present their visit credentials to the exhibitionOne certificate overview, three exhibitionsRealize efficient resource integration!

　　The entire chain leader will be further expanded,Covering from chips and chip design tocore componentsWaiting for key manufacturing processes

This exhibition presentsChip and chip design、Wafer Manufacturing、encapsulation testing、semiconductor equipment、semiconductor material、core componentswaitWhole chain ecological layout. The product range covers AI chips, communication chips, storage chips CPU、 Sensors, power management and RF chips, IP/EDA, Fabless, Foundry, OSAT and testing services, wide bandgap semiconductors such as silicon carbide, gallium nitride, diamond, gallium oxide, etcpower deviceManufacturing equipment for key processes such as photolithography, etching, and deposition, core materials such as silicon wafers, target materials, photoresist, and electronic specialty gases, as well as core components such as electrostatic suction cups, vacuum pumps, and RF power supplies.

Successfully attracted leading companies in the entire integrated circuit industry chain to actively participate in the exhibition, and some representative companies have the following lineup:

　　▶Chips and chip design/power semiconductors:ZTE Microelectronics, China Resources Microelectronics, BYD Semiconductor, Aite Microelectronics, Beijing Junzheng, Lanqi Technology, Ziguang Guowei, Guangli Microelectronics, Fudan Microelectronics, Canxin Semiconductor, Pu Rui Integration, Jihai Semiconductor, Chengdu Huawei Microelectronics, Guoxin Technology, Computing Technology, Jingwei Qili, Hongxin Micro Nano, Zhuhai Xindong Power, Jindi Spacetime, Junzhan Technology, Liuyue Microelectronics, Binary Semiconductor, Chengling Microelectronics, Damo Institute Xuantie, Meichuanxi, Qingxin Zhiyan, Sino German Industry, Huayuan Microelectronics, Sikai Mai, Jiagang Technology, Miaocun Technology, Yiwei Technology, Zhixian Future, Taixin Semiconductor, Xiangdixian, Zhixinke, Lankun Microelectronics, Advinno et al.

　　▶Wafer manufacturing and packaging testing technology and services:Huahong Group, Jita Semiconductor, Jinghe Integration, Xinxin Shares, Zengxin Technology, Tongfu Microelectronics, Huatian Technology, Xinzhi Microelectronics, Baiwei Storage, Times Minxin, Ruili Pingxin, Xinhe Xin, Anji Haiwanxin, etc.

　　▶Semiconductor equipment:Shengmei Shanghai, Tuojing Technology, Huahai Qingke, Weichong Semiconductor, Huayu Semiconductor, Jingce Electronics, Beijing Zhongdian Science and Technology, Zhongke Feice, Longyoude, Huazhuo Jingke, Maiwei Technology, Dongfang Jingyuan, Weijia Technology, Sanfeng Precision, Rongdao Society, Guanli Technology, Guangyi Semiconductor, Lichun Clean, Haimu Xinwei, Jinshang Zhizao, Junhua Semiconductor, Zhihe Semiconductor, Weijia Technology, Weifa, Quaternion, Haiyun Semiconductor, Aien, Botao Intelligence, Xinhui Lianxin, Jiazhicai, Yuntaili, Yichuang Technology, Mifan Technology, Changding Electronics, Stable Dingju Core, Huafeng Technology, Zhongke Four Zero, and Shangke Excellent.

　　▶Semiconductor materials:Shanghai Silicon Industry, Tianke Heda, Dianke Materials, Anji Technology, CSSC Special Gas, Shanghai Xinyang, Qingyiwei, Xilong Science, Chengdu Charcoal, Mulinsheng, Benlang New Materials, Yisheng Technology, Zhongbao New Materials, Guiyan Semiconductor, Huarong Technology, Daochuan Semiconductor Materials, Yunsheng New Materials, Kunwu, Qiameisi, Yuteng, Chenyi Technology, Boshicheng, Oulai New Materials, Chuangge, Jimec, Aikemai, Wald, Fushun Special Steel, Zhongse Oriental Group, YINCAE Yingkai, Siste, etc.

　　▶Semiconductor core components:Zhongke Instrument, Xinsong Semiconductor, Wanrui Cold Electric, Shangyin Technology, Xinlai Group, Canrui Technology, Sibeike, Keyence, Guanye Transmission, Sida Quan, Xingqi Semiconductor, Youfumi, Baishiji, Gaochuan Automation, Delike, Qingneng Dechuang, Zhaomo Semiconductor, Ami Precision Control, Yinguan Semiconductor, Qilike, Moshen, Emanoguan, Leisai, Yirui, Kronos, Yinguang Robot, Shenyang Jiwei, Koris, Hengchuan Robot, etc.

　　▶Research institutes and universities:Tsinghua University (School of Integrated Circuits), Shanghai Institute of Integrated Circuit Materials, Shenzhen Pinghu Laboratory, Guangdong Greater Bay Area Institute of Integrated Circuit and System Applications, Shanghai Jiao Tong University Wuxi Photon Chip Research Institute, Sun Yat sen University School of Integrated Circuits, Guangzhou Hong Kong University of Science and Technology Huo Yingdong Research Institute, Shenzhen Advanced Electronic Materials International Innovation Research Institute, Guangdong Zhongke Semiconductor Micro Nano Manufacturing Technology Research Institute, Beijing Institute of Technology Chongqing Microelectronics Research Institute, Shenzhen University of Technology, Shenzhen Institute of Integrated Circuit, South China Normal University School of Microelectronics, Shenzhen Vocational and Technical University School of Integrated Circuit, etc.

　　Opening Ceremony and Summit ForumGathering top industry experts，focusIndustry hot topics

exhibitionOpening Ceremony and Integrated Circuit Innovation Summit ForumIt will be held grandly on September 9th, covering hot topics throughout the entire chain including design, manufacturing, packaging and testing, equipment, materials, and safety applications. The opening ceremony was held byPresident of Guangdong Integrated Circuit AssociationChen Wei served as the host and invited academicians, experts, and industry association leaders to deliver speeches. Summit Forum morning gatheringTongfu MicroelectronicsChairman Shi LeiEmpyreanChairman Liu WeipingMuxi IntegrationFounder Chen WeiliangXMCCEO Sun Peng高通Meng Pu, Chairman of the China RegionZhongke Feice TestingChairman Chen Lu and other industry leaders delivered keynote speeches. The afternoon session will be held byShengmei SemiconductorJia Zhaowei, Senior Vice President of TechnologyUnigroup GuoxinChairman Chen JieShanghai Oriental Computing ChipVice President Guo WeiShanghai Silicon Industry GroupExecutive Vice President Li WeiChina Shipbuilding PerryVice General Manager Ding ChengHuiding TechnologyCTO PiboFudan MicroelectronicsVice General Manager Yu JianJiangfeng ElectronicsVice President Chen Hao and several other industry executives brought in-depth sharing.

　　20+high-quality professional conferencesFeaturing 5 distinctive exhibition areasCreating a fully closed-loop technology application ecosystem

More than 20 high-quality professional conferences were launched during the exhibition, coveringChips anditsApplications, semiconductor manufacturing, advanced packaging testing, wide bandgap semiconductors, intelligent manufacturing, green factory servicesKey conferences in core areas include but are not limited to the "AI Computing Era Silicon Optics Industry Summit" focusing on the development of AI computing power and innovation in silicon optics technology, the "RISC-V Industry Ecology Innovation Conference", "AI Empowered Consumer Electronics Innovation Forum", "Intelligent Terminal Chip Ecology Summit" closely related to chip and chip application issues, and the "IWAPS International Advanced Photolithography Technology Seminar", "Global Semiconductor Analyst Conference", "Advanced Materials Innovation and Development Conference", "Semiconductor Manufacturing Core Equipment and Component Development Forum", "Advanced Packaging and Testing Technology Forum", "China Micro LED CPO Industry Chain Innovation and Development Summit Forum" focusing on key links in semiconductor manufacturing. Focusing on the upgrading of the intelligent manufacturing industry, there are events such as the "Tailored Intelligent Industry Conference" and the "Intelligent Industrial Control Empowering Automation Innovation Forum". Gathering hundreds of global industry leaders, authoritative experts, and senior analysts, focusing on industry pain points, dismantling technology trends, sharing practical experience, and providing forward-looking guidance for industry development.

In addition, the exhibition collaborates with multiple well-known media and professional organizations to anchor industry core trends and create five distinctive exhibition areas:AI+Featured Display AreaFrom chip to system, reconstruct AI computing power and intelligent car foundation、 RISC-V Ecological Application Exhibition Area, Chip and Design Exhibition Area, IWAPS Lithography Exhibition Area, University and Research Institute Exhibition AreaCovering the entire process from chip design, manufacturing technology to scene implementation. Concentrate on showcasing open source architecture benchmarks such as Damo Institute's Xuantie series chips, high-performance automotive MCU chips, ultra-low power end side multimodal inference chips, as well as integrated solutions for stable mass production of photolithography processes and next-generation semiconductor technology iterations.

　　Strong alliance of three exhibitions to achieve deep cross-border linkage of industries

thisIC Innovation ExpoandCIOE China Light ExpoelexconShenzhen International Electronics ShowThe three exhibitions will be held simultaneously and in the same location to achieve deep cross industry linkage. comprehensive coverageFocusing on the three core areas of optoelectronics, integrated circuits, and electronic embedded systems, with a focus on AI computing power, consumer electronics&ARVR, automotive and robotics, and semiconductor and intelligent manufacturingBy waiting for the core track, we will build a full chain industry professional platform that integrates product display, technical exchange, business docking, and cutting-edge discussions, becoming an annual industry event that industry audiences must visit.

Among them, the AI computing power track focuses on showcasing core achievements in computing infrastructure such as high-end computing chips, high-speed optical modules, advanced packaging technology, and high-speed interconnection solutions; The Consumer Electronics&ARVR track focuses on cutting-edge directions in consumer electronics such as intelligent terminal innovation solutions, new display technologies, spatial perception interaction systems, AR/VR machines, and core components; The automotive and robotics track deeply covers application fields such as automotive grade chips, in vehicle optoelectronic and sensing systems, industrial control chips, robot servo drive and perception solutions, etc; The semiconductor and intelligent manufacturing track runs through key links such as semiconductor materials, core equipment, packaging and testing technology, as well as industrial automation and overall solutions for smart factories, presenting a comprehensive view of industrial technology.

Viewers can register with one click and have access to three exhibitions and various forum activities with one pass.September 9-11, Shenzhen International Convention and Exhibition Center(Bao'an)， IICIE International Integrated Circuit Innovation Expo cordially invites industry colleagues from around the world to gather and jointly build a new ecosystem for the semiconductor industry!

　　CIOE China Light ExpoAs a comprehensive exhibition covering the entire optoelectronic industry chain, this exhibition brings together over 4000 high-quality exhibitors from more than 30 countries and regions around the world. The eight themed exhibitions cover information communication, precision optics, camera technology and applications, laser and intelligent manufacturing, infrared, ultraviolet, intelligent sensing, new displays AR & VR、 Optoelectronic innovation and other sectors.

　　Elexcon Shenzhen International Electronics ShowAs an important professional event focusing on electronic components and embedded technology in Shenzhen and southern China, this exhibition will be themed "All for AI, All for Green", highlighting core areas such as chips, storage, embedded and edge AI, power and power semiconductors, automotive electronics, electronic components and modules and solutions.

Three exhibitions have precise division of labor, complementary linkage, and complete coverage of computing power requirements throughout the entire chain. It can provide one-stop access to the entire AI optoelectronic cell storage ecosystem, and comprehensively inspect products and technologies in semiconductor material equipment, silicon optical CPO optical interconnection, HBM high-speed storage, and whole machine embedded solutions.