SMICE2026 International Integrated Circuit Innovation Expo Shenzhen grandly opens, focusing on the synergy and symbiosis of chip light aggregation

On September 9th, 2026,IICIE International Integrated Circuit Innovation ExpoIt will be held grandly at the Shenzhen International Convention and Exhibition Center (Bao'an). The exhibition focuses on technological innovation, product iteration, and industrial implementation of the entire integrated circuit and semiconductor chain, covering chip design, wafer manufacturing, advanced packaging and testing, semiconductor equipment and core materials, key components, compound semiconductors, and morepower deviceIn core areas, leading enterprises in the upstream and downstream of the industrial chain are gathered to make a concentrated appearance. The exhibition focuses on showcasing cutting-edge technological achievements, creating an international industrial platform that integrates technology exchange, business docking, achievement transformation, and ecological co construction, and building a core display highland for the high-quality development of the domestic semiconductor industry.

As an annual heavyweight event in the semiconductor industry, this exhibition focuses on showcasing the breakthrough achievements and new ecological synergy of the domestic semiconductor industry. Currently, the domestic semiconductor industry is rapidly advancing the expansion of advanced process capacity, continuously accelerating breakthroughs in high-end technology fields such as 2.5D/3D advanced packaging and multi-dimensional heterogeneous integration; The localization process of semiconductor core materials is steadily accelerating, and the front-end core equipment is achieving high-end iteration and upgrading. The overall industry has completed two core transitions:technical levelFrom the basic adaptation of mature processes that are "usable and sufficient", to the high-end breakthrough of advanced processes and advanced packaging that are "user-friendly and leading";At the level of development modelFrom the point development of independent breakthrough of a single enterprise, it has transformed into a new pattern of ecological competition with full chain linkage and multi-party collaboration.

At the opening ceremony of this exhibition, hundreds of guests gathered, includingCao Jianlin, Honorary Chairman of the Organizing Committee of the International Integrated Circuit Innovation Expo (IICIE), former Deputy Minister of Science and Technology, and Chairman and Director of Jihua Laboratory，Ye Tianchun, Chairman of the Organizing Committee of the International Integrated Circuit Innovation Expo (IICIE), Chief Technical Engineer of the National 02 Special Project, and Researcher at the Institute of Microelectronics, Chinese Academy of Sciences，Du Xiaoli, Deputy Chief Technical Engineer of National 01 Special Project and Vice President of Lenovo Research Institute，Zhu Yu, Deputy Chief Technical Engineer of National 02 Special Project and Professor at Tsinghua University，Zhang Wei, Deputy Chief Engineer of National 02 Special Technology, Chairman and General Manager of Fudan Microelectronics Group，Lei Zhenlin, Chairman of the Integrated Circuit Component Innovation Alliance，Shi Lei, Chairman and President of Tongfu Microelectronics Co., Ltd，Wei Yayi, Researcher of Institute of Microelectronics, Chinese Academy of Sciences, SPIE, Chinese Optical Society, Member, Secretary General of IWAPS ConferencePresident of Guangzhou Semiconductor AssociationChen Wei，Yang Xiancheng, Founder and Executive Chairman of China International Optoelectronics Expo, and President of Shenzhen Optical Optoelectronics Industry AssociationKey enterprises, universities, research institutes, and media representatives from various links of the integrated circuit and semiconductor industry chain injected strong industry influence and professional expertise into the opening ceremony.

This exhibition breaks the boundary limitations of a single segmented industry exhibition and is held simultaneously with CIOE China Light Expo, Elexcon Shenzhen International Electronics Exhibition and Embedded Exhibition. The three major exhibitions have complementary positioning and deep industrial chain connection, with a total exhibition area of 320000 square meters, gathering over 5000 exhibiting companies and expected to attract more than 240000 professional visitors. The linkage of the three exhibitions effectively connects the cross-border channels of the semiconductor, optoelectronic, and electronic industries, laying a solid foundation for industrial integration and innovation.

　　Leading enterprises in the entire industry chain gather to showcase domestic productionSemiconductor ManufacturingHardcore strength

The exhibition, with its strong industry appeal, gathers core enterprises in the entire chain of chip design, wafer manufacturing and packaging testing, semiconductor materials/equipment/components, and presents a clear upstream and downstream collaborative system of the semiconductor supply chain. It also highlights the technological foundation and development vitality of the domestic semiconductor industry.

The manufacturing and specialty craftsmanship track is full of highlights, gathering togetherHuahong Group, Jita Semiconductor, Crystal Integrated, XinxinshareZengxin TechnologyTongfu MicroelectronicsHuatian Technology, Xinzhiwei, Baiwei Storage, Times Minxin, Ruili Pingxin, New Core、Anji HaiwanxinRepresentative enterprises, among whichJita SemiconductorBring advanced logic technology, mixed signal technology, and power device technology;Xinzhi MicroFocusing on the advanced packaging track of AI, providing highly reliable packaging and testing services for domestic design enterprises, deeply empowering cutting-edge markets such as display, storage, HPC, etc;Ruili PingxinDeeply cultivate FDSOI's characteristic advanced technology, and create advanced logic and characteristic process solutions of 2x nanometers and below;Anji HaiwanxinFocusing on advanced 2.5D/3D packaging, we provide one-stop services for packaging design, simulation, and chip production. Our core technologies cover WLCSP, FOSiP, and CoWoS, CPO, Chiplet advanced heterogeneous integration technologies for AI and HPC.

Semiconductor equipment is also a core highlight of this exhibition, gathering benchmark domestic semiconductor equipment enterprises includingShengmei Shanghai, Tuojing Technology, Huahai Qingke, Weichong Semiconductor, Huayu Semiconductor, Jingce Electronics, Beijing Zhongdian Technology, Zhongke Feice, Huazhuo Jingke, Dongfang JingyuanWaiting for enterprises to bring a full range of independently controllable semiconductor equipment and solutions.Tuojing TechnologyShowcasing the technological achievements of 3D IC equipment and exploring the breakthrough and collaborative development path of domestic equipment technology;Huahai QingkeShowcasing a complete set of process equipment including chemical mechanical polishing machines, thinning and polishing integrated machines, and single-chip cleaning machines;Weichong SemiconductorBring self-developed second harmonic wafer inspection, thermal wave measurement, and ultrasonic scanning microscope series equipment;Huayu SemiconductorLaunching a complete set of automated packaging and testing equipment, covering multiple scenarios such as sorting and tape production, substrate film application, and intelligent warehousing, to help reduce costs and increase efficiency in production lines;Precision Testing ElectronicsWe will make a heavyweight debut with our semiconductor full field quantity detection solution to fully empower the semiconductor industry chain quantity detection technology services from silicon wafers to wafers to chips.Beijing Zhongdian Technology Co., LtdOn site display of 8-inch and 12 inch SiC wafers, presenting a full range of cutting, grinding, and polishing equipment matrix, witnessed the latest achievements of domestic high-end thinning equipment.

　　Shanghai Silicon Industry, Tianke HedaElectronic Science and Technology MaterialsAnji Technology, CSIC Special Gas, Shanghai Xinyang, Qingyiwei, Xilong Science and TechnologyWaiting for semiconductor material companies, andMiddleKeyi, Xinsong Semiconductor, Wanrui Cold Electric, Shangyin Technology, Xinlai Group, Canrui Technology, Sibeike, Keyence, Guanye Transmission, Sida Quan, Xingqi Semiconductor, Zhongke Four ZeroBy waiting for the collective appearance of core enterprises in equipment components, we aim to achieve full coverage of the entire chain of semiconductor equipment, materials, and components, fully demonstrating the integrity and collaborative innovation capabilities of the domestic semiconductor industry ecosystem.

Furthermore,ZTE Microelectronics, China Resources Microelectronics, BYD Semiconductor, iTech Microelectronics, Beijing Junzheng, Lanqi Technology, Ziguang Guowei, Guangli Microelectronics, Fudan MicroelectronicsWaiting for all the top chip companies to participate in the exhibition, showcasing the full stack solutions of chips in fields such as automotive electronics, industrial control, consumer electronics, new energy, AI computing power, etc;

　　ZTE MicroelectronicsBring full stack self-developed optical products and core optoelectronic fusion technologies that are adapted to intelligent computing AI, backbone urban transmission, satellite lasers, and broadband access scenarios;Ziguang GuoweiFeaturing cutting-edge technology products from its subsidiary Ziguang Tongxin and Guoxin Jingyuan, it made a heavyweight debut; Huaqiang Semiconductor Group exhibited a complete set of solutions including Ascend Edge Intelligent Computing Standard Card Integrated Machine and Kunpeng Industrial Control Motherboard, demonstrating the full chain intelligent empowerment capability from hardware base to scene landing.

　　AI computing power demandoutbreakOptoelectronic integration becomes the core proposition of industrial transformation

With the continuous expansion of large model computing power clusters and exponential growth in parameter volume, the industry consensus has become clear: in the era of AI and HPC, the core upper limit of system performance is determined by interconnect energy efficiency. Traditional electrical interconnection solutions suffer from prominent bandwidth bottlenecks and high transmission power consumption, which cannot support the efficient operation of ultra large scale computing power networks with tens of thousands of cards. In August of this year, Nvidia announced the full production of the world's first 200G/lane CPO co packaged optical Ethernet switch system, marking the official upgrade of SiPh and CPO technology from an "optional technical solution" to the next generation of computing power system iterationRequired Core Path.

Under the trend of industrial transformation, the three major exhibitions of semiconductor, optoelectronics, and electronics have landed simultaneously, fully unleashing the synergistic advantages of cross track clustering, empowering and accelerating industrial upgrading

　　firstlyAdvanced semiconductor technology for optoelectronicsAnd storageThe large-scale development of industries provides solid support.Mature CMOS wafer production line realizes mass production of silicon photonics technology; Advanced packaging technology supports the large-scale implementation of CPO, NPO near package optics, heterogeneous integration, and HBM high bandwidth memory; The compound semiconductor process ensures the research and manufacturing of optical chips, continuously promoting the commercialization and popularization of new generation optoelectronic technologies.

　　TwoyesBreaking down the information barrier between chip manufacturers and optical module companies.The linkage of the three exhibitions enables face-to-face collaboration between the research and development of computing chips, switching chips, silicon optical engines, and high-speed optical devices, promoting the rapid transition of optoelectronic fusion packaging solutions from concept verification to joint implementation.

　　threeyesConnect the entire chain innovation ecosystem, fully connectedComputing power chip - high-speed interconnectionlightThe complete innovation chain of devices electronic hardware terminal applications.The linkage of the three exhibitions has shortened the upstream and downstream supply and demand docking cycle, and opened up the conversion channel from technology research and development, sample testing, system integration to commercial implementation.

At the same time, the linkage of the three exhibitions has also built an integrated exchange platform for cross-border talents, projects, and capital in the three major industries of optoelectronic semiconductors and electronics, promoting collaborative innovation in the industrial chain and empowering the high-quality construction of next-generation computing infrastructure.

　　High standard summits are being held intensively, with top think tanks predicting the future of the industry

The flagship event of this exhibition, the Opening Ceremony and Integrated Circuit Innovation Summit Forum, gathers elites from various fields of government, industry, academia, research, and application to create a high-level and high-value industry intellectual feast. The forum was chaired by Chen Wei, President of Guangdong Integrated Circuit Association, and invited academicians, experts, and industry association leaders to deliver heavyweight speeches. Industry leaders such as Shi Lei, Chairman of Tongfu Microelectronics, Liu Weiping, Chairman of Huada Jiutian, Meng Pu, Chairman of Qualcomm China, Sun Peng, CEO of Wuhan Xinxin, Chen Weiliang, founder of Muxi Integration, and Chen Lu, Chairman of Zhongke Feice, delivered keynote speeches, sharing cutting-edge insights on core tracks such as advanced packaging and testing, EDA tools, global industrial cooperation, wafer manufacturing, intelligent computing power, and testing equipment. The afternoon session of the forum focused on industry hotspots, conducting in-depth discussions on core topics such as advanced packaging of AI chips, innovation in commercial aerospace integrated circuits, post Moore era chip design paradigms, core materials and special gas industries, end side chip security protection, and innovative practices in domestic chips. Senior executives from companies such as Shengmei Semiconductor, Ziguang Guoxin, Dongfang Computing, Shanghai Silicon Industry Group, CSSC Perry, Huiding Technology, Fudan Microelectronics, and Jiangfeng Electronics took turns sharing, connecting the entire industry chain and interpreting industry opportunities and challenges from multiple perspectives.

More than 20 high-level industry summits held during the same period of the exhibition, with "data prediction+trend interpretation+technology deepening" as the core, covering silicon optical manufacturing MicroLED CPO、 Advanced packaging, wide bandgap semiconductors, FDSOI technology, end side AI, RISC-V architecture, automotive chips, embodied intelligence and other popular tracks provide authoritative references for enterprise strategic layout, technology iteration, and market expansion. Among them, the 10th International Symposium on Advanced Photolithography Technology (IWAPS) focuses on cutting-edge technologies in the field of photolithography, promoting innovative breakthroughs in advanced processes; The Global Semiconductor Analysts Conference, with the theme of "Navigating the Semiconductor New Era from 2026 to 2030- Reshaping Industry Driving Forces, Moving from Zero Sum Game to Collaborative Innovation," predicts the industrial transformation path and new growth drivers for the next five years.

　　Deep linkage between industry, academia and research, activating new driving forces for the transformation of technological achievements

In order to accelerate the landing and transformation of cutting-edge semiconductor technologies and promote industrial innovation and upgrading, Hall 16 of this exhibition also set up a university and research institute exhibition area, gathering top domestic universities and research institutes to build a precise and efficient platform for industry university research integration. The participating institutions include over ten research institutions, including Tsinghua University (School of Integrated Circuits), Shanghai Jiao Tong University Wuxi Institute of Photonics and Chips, School of Microelectronics at South China Normal University, Guangdong Zhongke Semiconductor Micro Nano Manufacturing Technology Research Institute, Guangdong Greater Bay Area Integrated Circuit and System Application Research Institute, Huo Yingdong Research Institute at Guangzhou University of Science and Technology, School of Integrated Circuits at Sun Yat sen University, and Shenzhen University of Technology. The special zone focuses on cutting-edge technology research and development, talent cultivation, and achievement implementation, breaking down barriers between scientific research and industry, promoting precise matching between cutting-edge technology, scientific research achievements, innovative talents, and enterprise needs in universities, and injecting fresh water into the continuous innovation of the semiconductor industry.

This IICIE International Integrated Circuit Innovation Expo showcases the entire chain, focusing on the development of semiconductor manufacturing and grasping the industrial transformation trend of AI computing power and optoelectronic integration. From September 9th to 11th, the exhibition will continue to unleash the forward-looking value of the industry, gather global industrial resources, assist in the high-quality development of China's semiconductor industry, and empower global industry collaborative innovation and win-win new paths.