IICIE International Integrated Circuit Innovation Expo empowers the semiconductor industry and hits the forefront of the industry

From September 9th to 11th, 2026, the IICIE International Integrated Circuit Innovation Expo (referred to as the IC Innovation Expo) will be grandly held at the Shenzhen International Convention and Exhibition Center (Bao'an). The exhibition builds a full chain ecological layout of chips and chip design, wafer manufacturing, packaging and testing, core equipment, key materials and core components, and creates a comprehensive exhibition platform for the semiconductor manufacturing industry that integrates product display, technical exchange, business negotiation, and innovation discussion, injecting new momentum into the high-quality development of the global semiconductor industry.

Hotspot technologies converge to precisely anchor the forefront of the industry. This exhibition closely follows the development trend of the semiconductor industry in 2026 and focuses onAI computing power HBM、 Lithography technology, advanced processes, advanced packaging, breakthroughs in localization of equipment and materials, third-generation semiconductors, and optoelectronic integrationFocusing on the core hotspots of the industry, showcasing cutting-edge technologies and innovative achievements in the global semiconductor field, helping participating companies accurately grasp the pace of technological iteration, seize opportunities for domestic substitution strategies, and solve bottlenecks in industry development.

The linkage of the three exhibitions highlights the scale effect.The IC Innovation Expo will be held concurrently with the CIOE China Light Expo and Elexcon Shenzhen Electronics Show, with a total exhibition area of 340000 square meters and gathering over 5000 exhibiting companies. It is expected to attract more than 240000 professional visitors,Deeply linking core fields such as semiconductor manufacturing, integrated circuits, optoelectronics, and electronic embedded systems, achieving multi industry collaborative empowerment, and building a comprehensive and multi-level industrial exchange and cooperation system.

　　Global resource aggregation, precise coverage of international buyers

Relying on the platform advantage of strong linkage among the three exhibitions, this exhibition will focus on creating a global high-end buyer matrix,Accurately covering professional audiences in multiple countries and regions including the United States, Germany, the United Kingdom, India, Indonesia, Malaysia, Japan, South Korea, Singapore, etcTo achieve comprehensive access to high-quality overseas procurement resources, assist exhibiting companies in efficiently connecting with the global market, and broaden international cooperation channels.

　　Numerous well-known overseas corporate audiences will gather at the venue, including but not limited to：AGC、ASM International、ASMPT、DENSO、GlobalFoundries、Marvell、Tower Semiconductor、OSI Electronics, Nikon, Canon, Applied Materials, Tokyo Electronics, Koleos, Panlin, Edwan Testing, Disco, Dow Chemical, Honeywell, BASF, Samsung Semiconductors, UMC, United Technologies, Intel, Solskjaer, Nvidia, Texas Instruments, Infineon, STMicroelectronics, etc. (Only some companies, ranked in no particular order)

　　Full chain integration empowerment, covering diversificationIndustry andApplication group

Relying on the professional platform of three exhibition linkage, the exhibition realizes one-stop efficient docking of upstream and downstream resources, and comprehensively connects themChip Device Module Solution Application”The entire industry chain ecosystem. Exhibitors can not only accurately connect with each otherIDM、Fabless、Fab、OSATWaiting for the exhibition audience in the semiconductor core field, they can also face it directlyArtificial Intelligence, Consumer Electronics, Automotive, Communication and Computing, Display, Optoelectronics, New EnergyWaiting for professional groups in downstream application fields to provide one-stop and efficient empowerment for the development of key downstream areas. At the same time, participating companies can have in-depth exchanges with high-quality exhibitors who appear on the same stage, jointly explore the future development trends of the industry, seek cooperation opportunities, and significantly enhance the value of the exhibition; For visitors, the exhibition has launched a convenient service called "One Card Pass, Three Exhibitions", which can greatly improve the efficiency of visiting and achieve one visit and full chain harvest.

　　Deep integration of industry, academia and research, accelerating the transformation of innovative achievements

This exhibition deeply links top domestic and foreign research institutes, universities, and key laboratories, showcasing cutting-edge research and development achievements in the semiconductor field, building an integrated innovation ecosystem of "research and development transformation landing", promoting the rapid industrialization of technological achievements, and helping to enhance industrial innovation capabilities.Some participating institutions and universities include:Guangdong Zhongke Semiconductor Micro Nano Manufacturing Technology Research Institute, Huo Yingdong Research Institute of Hong Kong University of Science and Technology, School of Integrated Circuits at Sun Yat sen University, Guangdong Greater Bay Area Integrated Circuit and System Application Research Institute, School of Computational Microelectronics at Shenzhen Institute of Technology, School of Integrated Circuits at Tsinghua University, Hong Kong University of Science and Technology, School of Integrated Circuits at Beijing Institute of Technology, Wuxi Institute of Photonics and Chips at Shanghai Jiao Tong University, School of Integrated Circuits at Shenzhen Vocational and Technical University, School of Microelectronics at South China Normal University, School of Integrated Circuits at Shenzhen University of Technology, and Shenzhen Advanced Electronic Materials International Innovation Research Institute.

　　Form a complete matrix for semiconductor manufacturingLeading enterprises working together on the same stage

The exhibition builds a complete semiconductor industry matrix of "manufacturing packaging equipment materials components", gathers industry leaders at home and abroad, and comprehensively displays the core strength of the industry:

ØWafer manufacturing and packaging testing:Shanghai Huali, Dongfang Jingyuan, Jinghe Integration, BYD Semiconductor, Tongfu Microelectronics, Times Semiconductor, Yuntian Semiconductor, Huajin Semiconductor, Baiwei Storage, Tianxin InterconnectWaiting for enterprises to gather and showcase their core technologies and comprehensive services to demonstrate their hard power;

ØSemiconductor equipment:North Huachuang, Zhongwei Semiconductor, Shengmei Shanghai, Tuojing Technology, Shenyang Heyan, Yudu Semiconductor, Huahai Qingke, Weichong Semiconductor, Huayu Semiconductor, Longyoude, Jingce Electronics, CETC, Huazhuo JingkeEnterprises focus on key processes such as photolithography, etching, and quantity testing to showcase core technologies and innovations in semiconductor equipment;

ØSemiconductor materials:Shanghai Silicon Industry, Jiangfeng Electronics, Anji Technology, CSSC Special Gas, Shanghai Xinyang, Shanghai Integrated Circuit Materials Research Institute, Qingyi MicroelectronicsWaiting for enterprises will bring key materials such as silicon wafers, target materials, and special gases to support the independent and controllable upgrading of the industrial chain;

ØSemiconductor core components:Zhongke Instrument, Xinsong Semiconductor, Wanrui Cold Electric, Shangyin Technology, Xinlai GroupEnterprises will showcase semiconductor core components and intelligent manufacturing solutions;

　　Three exhibition linkage, gathering high-quality exhibitors in semiconductor manufacturing and packaging testing at the same time:Such as GlobalFoundries, Tower Semiconductor, ASMPT, Riyueguang, Huanxu Electronics, Schmico, Runhua Quanxin Micro, Qisheng, Jingchuang Advanced, Heyan, Qiqi, Pulixin, Weidi, Noding, Touchpoint, Shiyu, Yilong, Dacheng, Zhongwang Semicon, Zhongke Jinggong, Zhongke Guangzhi, Leishen, Shangjin, Yitiannuo, Zhilifang, Ketai Guangxin, Pusai ISMC、 Junhe Precision Machinery, Dingqi, Derui Precision, Sanying Precision Control, Ennaki, Bozhong Semiconductor, Chuangshijie, Weijian Intelligence, Oxford Instruments, Jiyong Commercial, etc. (Only partially representing enterprises, ranked in no particular order)

　　The chip exhibition area is making efforts,Full category coverage leads industry development

As the core of the industry, the exhibition will focus on presenting AI chips, communication chips, storage chips CPU、 A full range of products including sensors, analog/digital chips, power management, RF, and driver chips. The exhibition is currently attractingZTE Microelectronics, Beijing Junzheng, Lanqi Technology, Huada Jiutian, Guangli Microelectronics, Megachip IntegratedWaiting for enterprises to make a concentrated appearance, comprehensively showcasing the technological breakthroughs of domestic chips in high-performance, high reliability, automotive grade, and industrial grade fields, and connecting the "chip solution terminal" landing path.

Three exhibition linkage,ARM、 Renesas, Xuantie, Lingdong, National Technology, Guangyu Xinchen, Demingli, Dongxin, Langke, Kangying, Shanghai Beiling, Yangjie, Koda Jia, Xinwei, Xin'an Semiconductor, Chipsource, Taimao Semiconductor, Advantech, Feiling, Chuanglong Technology, Xingchen, AMS Osram, Coherent Gaoyi, Sols, Zhaoyi Innovation, Mitsubishi Electric, Sanan Optoelectronics, Ruishi, Ruixi Technology, Kunteng, Haisi, Hisense, Xinsijie, Qixin, Niobio Optoelectronics, Changguang Huaxin, Guoke Guangxin, Shijia, Dingxin, Cambridge Technology, Yunling, Guangsen, Zonghui Xinguang, Youxun Co., Ltd., Mingyi Technology, Gongyan Tuoxin, Chengke Micro, Mishi, LUXIC Gongxin Technology, Guangzi, BeilingMany high-quality enterprises will also participate in the exhibition at the same time, jointly building a new pattern of chip development. (Only partially representing enterprises, ranked in no particular order)

　　High standard forum held simultaneously, with domestic and foreign experts discussing the industry together

At the same time as this exhibition, there will be forums that highlight high-end, international, and professional development, creating a global semiconductor "intellectual highland". Over 20 professional forums focused onSemiconductor manufacturing, advanced packaging and testing, compound semiconductors, intelligent manufacturing, chips and chip applicationsFocus on solving core technology bottlenecks and supply chain collaboration challenges with precision.

asInternational Integrated Circuit Innovation Summit ForumWe will invite top academicians and experts in the industry, as well as leaders of leading enterprises, to hold peak dialogues on core topics such as "AI empowerment", "chip cloud collaboration", and "semiconductor industry chain supply chain resilience", and explore practical and feasible solutions;The 10th International Symposium on Advanced Photolithography Technology (IWAPS2026)Covering the entire chain ecology from lithography machines to photoresist materials, international giants such as KLA in the United States, Siemens in Germany, Fujifilm in Japan, as well as domestic leading enterprises such as FullChip Intelligent Manufacturing and Oriental Jingyuan, will deeply participate;Global Integrated Circuit Industry Analyst ConferenceWe will gather industry think tanks from 25 countries to predict the semiconductor market cycle and production capacity layout from 2026 to 2030.

In addition, the semiconductor manufacturing and advanced packaging and testing theme conference focuses on deepening the core links of the industry chain and concentrating onBreakthrough in HPC packaging technology, heterogeneous integration, key materials for AI heterogeneous integration packaging, and domestic breakthroughs in core componentsWe are committed to solving the industry's bottleneck problems; The Chip Design and Application Series Forum focuses on AI, consumer electronics, automotive RISC-V、 Build a bridge between "chip technology and terminal demand" in popular application fields such as industry and intelligent terminals.

　　Three exhibition linkage, more semiconductor industry related conferences at the same time, such asForum on Optoelectronic Fusion Technology and Industrial Development, Forum on Optical Semiconductor Testing Technology, Forum on Ultra Precision Micro/Nano Optical Manufacturing Technology, Forum on Nanoimprint Manufacturing Technology, Forum on Laser Technology Empowered Semiconductor Manufacturing, etc.

At present, over 80% of the exhibition booths have been reserved and are currently in full swing,Book and inquire about exhibition booths now，It can quickly connect high-quality resources in the semiconductor industry chain. For the convenience of visitors, the exhibition has launchedYizhengtong visits three exhibitionsConvenient service,Click here to register with just one clickBy completing registration, visitors can visit the three major exhibitions of IICIE, CIOE, and elexcon in one go. We sincerely invite people from all walks of life to gather in Shenzhen in September and join hands to build a new ecosystem for the semiconductor industry.