2026 World Manufacturing Conference - Semiconductor Industry and Electronic Technology Exhibition: Unveiling Anhui's Industrial Heights

As the wave of "New Four Modernizations" deeply reshapes the global manufacturing industry, semiconductor chips are becoming the winning and losing hand in determining the industry's height. The 2026 World Manufacturing Conference will be held from September 20-23, 2026 at the Binhu International Convention and Exhibition Center in Hefei. As the core section of the market-oriented exhibition of the conference, the Semiconductor Industry and Electronic Technology Exhibition will deeply reveal the industry highland behind it.

This exhibition is located in Hall 3, with an exhibition area of about 10000 square meters. Why did 400 companies gather in Anhui? This is the industrial highland with the highest automobile production in China and the fourth highest semiconductor storage in the world. It is the core pivot of the integration of manufacturing and science and technology innovation in the Yangtze River Delta, and also the benchmark province for China's new quality productivity.

　　01

　　The "first formation" of the whole vehicle is leading the way with strong momentum

　　Massive release of supply chain demand

As the "first industry" in Anhui, the automotive industry has gathered seven complete vehicle enterprises including Chery Automobile, NIO, Jianghuai Automobile, Hefei BYD, and Volkswagen Anhui, forming a "dual core" and multiple characteristic industrial clusters of automotive parts in Hefei and Wuhu. By 2025, the automobile production in Anhui Province will reach 3.6865 million vehicles, including 1.7941 million new energy vehicles, both ranking first in the country. From January to April 2026, the automobile production will be 754000 units and the new energy production will be 332000 units, continuing to lead the way; The export value increased by 118.8% year-on-year, and the export of electric vehicles increased by 300%, covering over 150 countries worldwide.

Behind Anhui becoming a true "super factory" for automobiles is a huge and urgent demand for supply chain procurement. At present, Anhui has gathered over 1600 large-scale automotive parts enterprises, optimized the whole to zero ratio to 1:1.4, and continuously improved the rate of near ground matching. The entire ecosystem covering "parts vehicle aftermarket" has been formed, from power batteries, intelligent chassis to perception systems. Holding this exhibition in Anhui, buyers and suppliers can have face-to-face negotiations to fully achieve efficient industrial integration.

　　02

　　The comprehensive rise of "chip car linkage"

　　Automotive grade semiconductors create unique labels

One of the core aspects of automotive supply chain security lies in chips. The electronic information manufacturing industry in Anhui Province has become the core engine driving the province's industrial growth, forming a complete industry chain of "design manufacturing packaging testing equipment". By 2025, the revenue of the integrated circuit industry in the province will exceed 160 billion yuan, with Hefei contributing over 100 billion yuan; Integrated circuit production reached 11.13 billion blocks, a year-on-year increase of+9%; 150 million storage chips, a year-on-year increase of 132.9%.

　　·Design: Agglomeration of Innovative Entities

There are more than 530 design enterprises in the province, mainly small and medium-sized enterprises and start-ups, with abundant innovation vitality. Enterprises such as Zhaoyi Innovation, Hengshuo Semiconductor, and Anxin Electronics have shown outstanding performance in the fields of storage and AI chips, forming a multi-point development pattern.

　　·Manufacturing: Leading in hardcore strength

Layout of 6 12 inch wafer fabs (3 already in operation and 3 planned for construction), with DRAM production ranking first in the country and fourth globally. In 2025, the production of storage chips will increase by 132.9% year-on-year, with a total monthly production capacity of over 200000 pieces, making it the core pillar of the semiconductor industry in the province.

　　·Sealed Test: Cluster Scale Effect

Gathering leading enterprises such as Huicheng Corporation, Huicheng's revenue will reach 1.783 billion yuan by 2025. Chizhou has formed an industrial cluster of 36 enterprises above designated size and 130 affiliated enterprises, with an annual output value exceeding 30.7 billion yuan, and the supporting industrial chain is becoming increasingly perfect.

　　03

　　Anchoring world-class blueprint for the 15th Five Year Plan

　　Trillion industries demonstrate unlimited potential

”In the first year of the 15th Five Year Plan, Anhui's manufacturing industry plan has been clearly outlined. The plan clearly states that by 2030, the province's automobile production will target more than 6 million vehicles, with new energy vehicles accounting for over 80% of the total, and the output value of the entire industry chain will exceed 2 trillion yuan. It will cultivate 3-5 world-class vehicle enterprises, and continue to lead the export of vehicles and components. What is more noteworthy is that Anhui will focus on building the "World Capital of New Energy Vehicles" and a globally influential innovation highland for automotive grade chips, promoting the localization and substitution of automotive electronics, high computing power chips, and automotive operating systems.

This means that in the next five years, Anhui will not only have a huge incremental space for vehicle manufacturing, but will also give rise to a multi trillion dollar incremental market for automotive electronics and semiconductors. The revenue of the integrated circuit industry in the province has exceeded 300 billion yuan, and the localization rate of automotive grade chips has reached 70%. The entire process of chip assembly and packaging has been closed-loop within the province, building a "one core, multiple" integrated circuit development pattern with Hefei as the core and Bengbu, Chuzhou, and Wuhu as the pivot points.

　　04

　　Semiconductor Industry and Electronic Technology Exhibition

　　Breaking through conventional exhibitions and promoting precise supply-demand matching

For global semiconductor industry chain suppliers, Anhui is a necessary bridgehead to seize. The 2026 World Manufacturing Conference - Semiconductor Industry Electronic Technology Exhibition is not just a regular exhibition, but also a source and deep interactive platform to connect new nodes in the global supply chain and lead the industry trend.

　　10000 square meters of display area, covering the entire industry chain

IC Design and Chips

Design tools and services (EDA software, IP cores, design services, embedded software, FPGA/ASIC design, IC layout design); CPU/GPU, AI chip, storage chip, communication/RF chip MCU、 Sensor chips, power chips, automotive grade chips, display driver chips, MEMS chips; Fabless/ODM/Foundry (fabless, integrated device manufacturer, wafer foundry services).

Semiconductor manufacturing equipment and core components

Lithography machine, etching machine, thin film deposition (CVD/PVD/ALD), ion implantation, oxidation/diffusion, cleaning equipment CMP、 Annealing/heat treatment, single crystal furnace, slicing/grinding/polishing/thinning, slicing/cutting, epitaxial growth equipment), measurement and testing (optical/electron beam measurement, defect detection, film thickness/stress)/resistivityTesting, wafer probe station, RF power supply, electrostatic suction cup (ESC), precision pump valves, flow meters, quartz/ceramic/silicon components, precision motion systems, robots, cleanroom accessories, etc.

semiconductor material

Silicon wafer (8/12 inches) SOI、 Sapphire, silicon carbide (SiC), gallium nitride (GaN), diamond, gallium arsenide (GaAs), photomask, photoresist and supporting reagents, electronic specialty gases, wet electronic chemicals, CMP polishing solution/pad, sputtering target material, photoresist remover, developer, packaging substrate (organic/ceramic/glass), lead frame, bonding wire, plastic packaging material, bottom filling adhesive, solder, thermal interface material, powder metallurgy, advanced ceramics, etc.

encapsulation testing

WLP、SiP、2.5D/3D、TSV、Chip let 、Fan-out、 Inverted, bump, panel level packaging, die bonding machine, wire bonding machine, plastic packaging machine, cutting/forming, testing machine, sorting machine, aging equipment, AOI testing, OSAT manufacturer, testing plan, reliability verification, failure analysis, etc.

Compound/Third Generation Semiconductor

SiC、GaN、GaAs、InP、ZnO、 Diamond, aluminum nitride, power devices, RF devices, optoelectronics LED、 Laser, detector, specialized equipment, epitaxy, substrate, packaging solution, etc.

Electronic intelligent manufacturing

SMT technology and equipment, smart factories in the electronics industry, testing and measurement, PCB and circuit carrier manufacturing, connector and wire harness processing, electronic components, electronic and chemical materials, etc.

New generation electronic information technology

Next generation communication networks, Internet of Things, triple play, cloud computing, etc.

Semiconductor chips and device applications

Display and application, 3D glass, touch screen module, automotive electronics, 5G/communication, AI computing power, data center, new energy, industrial control, consumer electronics, medical electronics, aerospace, etc.

　　Multiple concurrent events, forward-looking hot topics

The exhibition will hold multiple in-depth industry linkage conferences and activities at the same time, covering the hot topics of the entire industry chain from materials, design, manufacturing, packaging and testing to terminal applications. By inviting industry experts to jointly create an efficient interactive platform for one-stop technical exchange and supply and demand cooperation, we aim to expand the resources of the semiconductor and automotive supply chain track and seize industry window opportunities.

Power Semiconductor and Quartz Materials and New Energy Vehicle Application Conference

Advanced Packaging Global Technology and TGV Industry Science and Technology Innovation Conference

Diamond High Quality Development and Advanced Ceramic Application Technology Conference

Semiconductor Technology and Integrated Circuit Industry Summit

Automotive Industry Chain Supply and Demand Matchmaking Exchange Conference

　　Face to face negotiations and joint efforts to invite precise customer groups

The exhibition will integrate high-quality industry resources, gather targeted audiences through multiple channels such as precise online coverage, offline visits and invitations, and cooperation with partner units, allowing more enterprises to seize professional technical exchange opportunities, understand the latest industry trends, expand network resources, negotiate face-to-face cooperation, update technology products, and jointly build an open industry interactive ecosystem.

1. Communication and smartphones PC、 Leaders of terminal application enterprises such as tablet computers, intelligent automotive industry, medical, 3C, laptops, and consumer electronics.

2. Senior leaders and technical leaders of upstream and downstream enterprises in the semiconductor industry, including integrated circuit design, manufacturing, packaging and testing, semiconductor materials, and equipment.

Senior leaders and technical leaders of terminal application enterprises in low altitude economy, aerospace economy, aerospace, national defense and military industry, radar, medical, photovoltaic, optical communication, optical modules, etc.

4. Executives from enterprises such as 5G applications, big data, the Internet of Things, intelligent automotive networking, intelligent driving, automotive electronics, vehicle and automotive parts factories, and lithium batteries.

5. Representatives from government departments, industry associations/societies, and research institutes; Mainstream/professional media professionals and semiconductor investors.

September 20-23, 2026

Looking forward to meeting in Hefei

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