Copper hole probe ETP

Copper hole probe ETP

Apply eddy current testing technology. When measuring, the probe releases electromagnetic waves. When the magnetic field cuts the metal layer, a change in the magnetic field occurs. By calculating this change, the copper thickness of the hole wall can be determined. The measurement is not affected by the inner layer of the board, even for double-layer or multi-layer boards, and can still work well even with tin or tin/lead protective layers. In addition, the probe adopts temperature compensation technology, which can measure the thickness of copper holes even for plates that have just been taken out of the plating tank.